Memory cell having nonmagnetic filament contact and methods of operating and fabricating the same

ABSTRACT

A magnetic cell structure including a nonmagnetic filament contact, and methods of fabricating the structure are provided. The magnetic cell structure includes a free layer, a pinned layer, an insulative layer between the free and pinned layers, and a nonmagnetic filament contact in the insulative layer which electrically connects the free and pinned layers. The nonmagnetic filament contact is formed from a nonmagnetic source layer, also between the free and pinned layers. The filament contact directs a programming current through the magnetic cell structure such that the cross sectional area of the programming current in the free layer is less than the cross section of the structure. The decrease in the cross sectional area of the programming current in the free layer enables a lower programming current to reach a critical switching current density in the free layer and switch the magnetization of the free layer, programming the magnetic cell.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.12/352,182, which was filed on Jan. 12, 2009, now U.S. Pat. No.7,957,182, which issued on Jun. 7, 2011.

BACKGROUND

1. Field of Invention

Embodiments of the invention relate generally to magnetic random accessmemory, and more particularly, to Spin Torque Transfer Magnetic RandomAccess Memory (STT-MRAM).

2. Description of Related Art

This section is intended to introduce the reader to various aspects ofart that may be related to various aspects of the present invention,which are described and/or claimed below. This discussion is believed tobe helpful in providing the reader with background information tofacilitate a better understanding of the various aspects of the presentinvention. Accordingly, it should be understood that these statementsare to be read in this light and not as admissions of prior art.

Magnetic Random Access Memory (MRAM) is a non-volatile computer memorytechnology based on magnetoresistance. MRAM differs from volatile RandomAccess Memory (RAM) in several respects. Because MRAM is non-volatile,MRAM can maintain memory content when the memory device is not powered.Though non-volatile RAM is typically slower than volatile RAM, MRAM hasread and write response times that are comparable to that of volatileRAM. Unlike typical RAM technologies which store data as electriccharge, MRAM data is stored by magnetoresistive elements. Generally, themagnetoresistive elements are made from two magnetic layers, each ofwhich holds a magnetization. The magnetization of one layer (the “pinnedlayer”) is fixed in its magnetic orientation, and the magnetization ofthe other layer (the “free layer”) can be changed by an externalmagnetic field generated by a programming current. Thus, the magneticfield of the programming current can cause the magnetic orientations ofthe two magnetic layers to be either parallel, giving a lower electricalresistance across the layers (“0” state), or antiparallel, giving ahigher electrical resistance across the layers (“1” state). Theswitching of the magnetic orientation of the free layer and theresulting high or low resistance states across the magnetic layersprovide for the write and read operations of the typical MRAM cell.

Though MRAM technology offers non-volatility and faster response times,the MRAM cell is limited in scalability and susceptible to writedisturbances. The programming current employed to switch between highand low resistance states across the MRAM magnetic layers is typicallyhigh. Thus, when multiple cells are arranged in an MRAM array, theprogramming current directed to one memory cell may induce a fieldchange in the free layer of an adjacent cell. This potential for writesdisturbances, also known as the “half-select problem,” can be addressedusing a spin torque transfer technique.

A conventional spin torque transfer MRAM (STT-MRAM) cell may include amagnetic cell stack, which may be a magnetic tunnel junction (MTJ) or aspin valve structure. An MTJ is a magnetoresistive data storing elementincluding two magnetic layers (one pinned and one free) and aninsulating layer in between, a bit line, a word line, a source line, andan access transistor. A spin valve has a structure similar to the MTJ,except a spin valve has a conductive layer in between the two magneticlayers. A programming current typically flows through the accesstransistor and the magnetic cell stack. The pinned layer polarizes theelectron spin of the programming current, and torque is created as thespin-polarized current passes through the stack. The spin-polarizedelectron current interacts with the free layer by exerting a torque onthe free layer. When the torque of the spin-polarized electron currentpassing through the stack is greater than the critical switching currentdensity (J_(c)), the torque exerted by the spin-polarized electroncurrent is sufficient to switch the magnetization of the free layer.Thus, the magnetization of the free layer can be aligned to be eitherparallel or antiparallel to the pinned layer, and the resistance stateacross the stack is changed.

The STT-MRAM has advantageous characteristics over the MRAM, because thespin-polarized electron current eliminates the need for an externalmagnetic field to switch the free layer in the magnetoresistiveelements. Further, scalability is improved as the programming currentdecreases with decreasing cell sizes, and the write disturbance andhalf-select problem is addressed. Additionally, STT-MRAM technologyallows for a higher tunnel magnetic resistance ratio, meaning there is alarger ratio between high and low resistance states, improving readoperations in the magnetic domain.

However, high programming current densities through the STT-MRAM cellmay still be problematic. High current densities through the magneticlayers may increase the energy consumption in the cell and the thermalprofile in the layers, affecting the cell's integrity and reliability,and may also lead to larger silicon real estate consumption for eachcell.

BRIEF DESCRIPTION OF DRAWINGS

Certain embodiments are described in the following detailed descriptionand in reference to the drawings in which:

FIG. 1 depicts a graph illustrating the relationship between programmingcurrent direction and the resistance states in an STT-MRAM cell, inaccordance with an embodiment of the present technique;

FIG. 2 depicts a block diagram of a processor-based system in accordancewith an embodiment of the present technique;

FIG. 3 depicts a schematic diagram of a portion of a memory array havingmemory cells fabricated in accordance with embodiments of the presenttechnique; and

FIG. 4A and FIG. 4B depict STT-MRAM cell structures before and after anonmagnetic filament contact is formed, in accordance with embodimentsof the present technique.

DETAILED DESCRIPTION

As previously discussed, a spin torque transfer magnetic random accessmemory (STT-MRAM) cell is programmed by switching the magnetization ofthe free layer in the STT-MRAM cell's magnetic cell stack. Typically,the free layer magnetization can be in a direction either parallel tothe pinned layer magnetization, or antiparallel to the pinned layermagnetization. When the magnetizations of the free and pinned layers areparallel, the resistance across the layers may be low, and when themagnetizations of the free and pinned layers are antiparallel, theresistance may be high. Thus, an STT-MRAM cell may be programmed toeither a low or a high resistance state.

Switching of the free layer magnetization (and of the resistance stateof the cell) occurs when the current density passing through the memorycell is larger than the critical switching current density. An exampleof how the resistance across a magnetic cell structure in an STT-MRAMcell may change based on a programming current is depicted in the graphof FIG. 1. The values used in this graph are examples to illustrate ageneral relationship between a programming current and STT-MRAM cellresistance states. STT-MRAM cells, in embodiments of the presenttechnique, may be programmed with different current values, and may havevarious resistance values in different programmed states. In the graphof FIG. 1, the cell is programmed to a high resistance state R_(HIGH) atapproximately 130 ohms when the programming current is below −1 mA. Thecell is programmed to a low resistance state R_(LOW) at approximately111 ohms when the programming current is above 1 mA. The negative andpositive programming current values may indicate that the programmingcurrent is applied in opposite directions through the magnetic cellstack. Programming currents in opposite directions may have electronswith spin polarization directions that switch the free layermagnetization in opposite directions (i.e., parallel or antiparallel tothe pinned layer magnetization).

When the current through the cell is not below −1 mA or not above 1 mA,then the programming current may not be great enough to switch the freelayer magnetization. More specifically, the current density in the freelayer may not reach the critical switching current density of the freelayer. If the programming current does not have a current density in thefree layer that is sufficient to switch the magnetization, the cell maybe at either resistance state, as indicated by hysteresis segmentsH_(HIGH) and H_(LOW) when the current is between −1 mA and 1 mA.

Thus, to program the cell, the programming current density need only beslightly higher than the critical switching current density. Sincepassing a larger programming current increases the energy consumptionand the thermal profile in the cell stack, which affects the integrityand reliability of the cell, it is desirable to decrease the criticalswitching current without affecting the cell's thermal stability.Applying a lower programming current while maintaining a programmingcurrent density that is above the critical switching current densitywould allow a smaller current to switch the free layer of the cell. Thefollowing discussion describes the systems and devices, and theoperation of such systems and devices in accordance with the embodimentsof the present technique.

FIG. 2 depicts a processor-based system, generally designated byreference numeral 10. As is explained below, the system 10 may includevarious electronic devices manufactured in accordance with embodimentsof the present technique. The system 10 may be any of a variety of typessuch as a computer, pager, cellular phone, personal organizer, controlcircuit, etc. In a typical processor-based system, one or moreprocessors 12, such as a microprocessor, control the processing ofsystem functions and requests in the system 10. As is explained below,the processor 12 and other subcomponents of the system 10 may includeresistive memory devices manufactured in accordance with embodiments ofthe present technique.

The system 10 typically includes a power supply 14. For instance, if thesystem 10 is a portable system, the power supply 14 may advantageouslyinclude a fuel cell, a power scavenging device, permanent batteries,replaceable batteries, and/or rechargeable batteries. The power supply14 may also include an AC adapter, so the system 10 may be plugged intoa wall outlet, for instance. The power supply 14 may also include a DCadapter such that the system 10 may be plugged into a vehicle cigarettelighter, for instance.

Various other devices may be coupled to the processor 12 depending onthe functions that the system 10 performs. For instance, a userinterface 16 may be coupled to the processor 12. The user interface 16may include buttons, switches, a keyboard, a light pen, a mouse, adigitizer and stylus, and/or a voice recognition system, for instance. Adisplay 18 may also be coupled to the processor 12. The display 18 mayinclude an LCD, an SED display, a CRT display, a DLP display, a plasmadisplay, an OLED display, LEDs, and/or an audio display, for example.Furthermore, an RF sub-system/baseband processor 20 may also be coupledto the processor 12. The RF sub-system/baseband processor 20 may includean antenna that is coupled to an RF receiver and to an RF transmitter(not shown). One or more communication ports 22 may also be coupled tothe processor 12. The communication port 22 may be adapted to be coupledto one or more peripheral devices 24 such as a modem, a printer, acomputer, or to a network, such as a local area network, remote areanetwork, intranet, or the Internet, for instance.

The processor 12 generally controls the system 10 by implementingsoftware programs stored in the memory. The software programs mayinclude an operating system, database software, drafting software, wordprocessing software, and/or video, photo, or sound editing software, forexample. The memory is operably coupled to the processor 12 to store andfacilitate execution of various programs. For instance, the processor 12may be coupled to the system memory 26, which may include spin torquetransfer magnetic random access memory (STT-MRAM), magnetic randomaccess memory (MRAM), dynamic random access memory (DRAM), and/or staticrandom access memory (SRAM). The system memory 26 may include volatilememory, non-volatile memory, or a combination thereof. The system memory26 is typically large so that it can store dynamically loadedapplications and data. In some embodiments, the system memory 26 mayinclude STT-MRAM devices, such as those discussed further below.

The processor 12 may also be coupled to non-volatile memory 28, which isnot to suggest that system memory 26 is necessarily volatile. Thenon-volatile memory 28 may include STT-MRAM, MRAM, read-only memory(ROM), such as an EPROM, resistive read-only memory (RROM), and/or flashmemory to be used in conjunction with the system memory 26. The size ofthe ROM is typically selected to be just large enough to store anynecessary operating system, application programs, and fixed data.Additionally, the non-volatile memory 28 may include a high capacitymemory such as a tape or disk drive memory, such as a hybrid-driveincluding resistive memory or other types of non-volatile solid-statememory, for instance. As is explained in greater detail below, thenon-volatile memory 28 may include STT-MRAM devices manufactured inaccordance with embodiments of the present technique.

FIG. 3 illustrates an STT-MRAM cell 50, which may be fabricated to forman array of memory cells in a grid pattern including a number of rowsand columns, or in various other arrangements depending on the systemrequirements and fabrication technology. An arrangement of memory cellsmay be implemented in the system memory 26 or the volatile memory 28depicted in FIG. 2.

The STT-MRAM cell 50 includes a magnetic cell structure 52, an accesstransistor 54, a bit line 56, a word line 58, a source line 60,read/write circuitry 62, a bit line reference 64, and a sense amplifier66. The magnetic cell structure 52 may include a spin valve. As will bedescribed further below with specific reference to FIGS. 4A-4B, thestructure 52 may further include a nonmagnetic contact between the freeand pinned layers in accordance with embodiments of the presenttechnique. In embodiments described below, the nonmagnetic contact inthe structure 52 may be a filament or filaments disposed or formedwithin the structure 52, and may be formed from nonmagnetic materiallayered in the structure 52.

As used herein, the STT-MRAM cell 50 generally includes a “magnetic cellstructure.” The magnetic cell structure may be a spin valve, asdiscussed above, if a nonmagnetic conductive layer is between a freelayer and a pinned layer. As used in the present specification, the term“structure” may include a magnetic cell structure, and may refer to amemory cell structure, magnetic cell structure, STT-MRAM cell structure,or any component of a memory cell which may include layers and materialsin accordance with an embodiment of the present technique. The term“structure” may also refer to transitional structures during processesto fabricate the magnetic cell structure, or a structure that has beenaltered from a previously fabricated structure, in accordance withembodiments of the present techniques.

As will be explained, the term “contact” may refer to a filament, abridge, a strip, or some other formation which provides a path orelectrical connection between the free layer and the pinned layer. Thecontact may comprise nonmagnetic materials from a layer of nonmagneticmaterial in the structure. As used herein, materials may be referred toas a “layer” when the material is formed above, below, or within thestructure. A layer may be either parallel or perpendicular to thestructure. In accordance with embodiments described below, thenonmagnetic layer may form a nonmagnetic contact through nanochannel(s),which may extend substantially perpendicularly through an adjacentlayer(s). Such nanochannels may be formed by applying an electric field,for example, or by any other process(es) in accordance with embodimentsof the present technique. It should be understood that when a layer issaid to be “formed on,” “formed below,” “disposed on,” or “disposedbelow” another layer, there may be intervening layers formed or disposedbetween those layers. Conversely, if a layer or material is said to be“formed directly on,” “formed directly below,” “disposed directly on,”“disposed directly below,” or “in direct contact with,” the materials orlayers include no intervening materials or layers therebetween.

During a write operation of an STT-MRAM cell 50 that is selected to beprogrammed, a programming current is applied to the cell. The electronsof the programming current are spin-polarized by the pinned layer toexert a torque on the free layer, which switches the magnetization ofthe free layer to “write to” or “program” the cell. To initiate thewrite operation, the read/write circuitry 62 may generate a writecurrent to the bit line 56 and the source line 60. The polarity of thevoltage between the bit line 56 and the source line 60 determines theswitch in magnetization of the free layer in the structure 52.Furthermore, and as discussed in detail below, forming a filament ofnonmagnetic material to electrically connect the free and pinned layersmay direct a programming current flow through the magnetic cellstructure 52 to decrease the cross sectional area of the programmingcurrent flow in the free layer of the structure 52. By decreasing thecross sectional area of the programming current through the free layer,a smaller programming current may still have a current density in thefree layer that is greater than the critical switching current densityrequired to switch the free layer magnetization. Thus, a smallerprogramming current may be used to write the STT-MRAM cell 50. Once thefree layer is magnetized according to the spin polarity of theprogramming current electrons, the programmed state is written to theSTT-MRAM cell 50.

In a read operation of the STT-MRAM cell 50, a current is used to detectthe resistance state of the magnetic cell structure 52. To initiate aread operation, the read/write circuitry 62 generates a read current tothe bit line 56 and the source line 60 through the structure 52 and thetransistor 54. The programmed state of the STT-MRAM cell 50 depends onthe resistance across the structure 52 which may be determined by thevoltage difference between the bit line 56 and the source line 60. Insome embodiments, the voltage difference may be compared to a reference64 and amplified by a sense amplifier 66.

One embodiment of the present techniques for programming a STT-MRAM cellwith a decreased programming current, is illustrated in FIGS. 4A and 4B.In one embodiment, the STT-MRAM cell includes a memory cell structure120 (FIG. 4B) having nonmagnetic filament contact 112 which may beemployed to decrease the cross sectional area of the programming currentflow. As will be further explained, this technique enables a lowerprogramming current to facilitate a switch in the magnetization of thefree layer 102 to program the memory cell.

The memory cell structure 100 of FIG. 4A may include a free layer 102and a pinned layer 108 with an insulative layer 104 and a nonmagneticsource layer 106 in between. The pinned layer 108 is so named because ithas a magnetization with a fixed or preferred orientation, and this isrepresented by the arrow indicating that the magnetization of the pinnedlayer 108 is oriented to the right. The free layer 102 has amagnetization which may be switched to allow the memory cell to beprogrammed. The structure 100 may also include an antiferromagneticlayer 110 below the pinned layer 108 to achieve the pinning throughexchange coupling and further increase cell stability.

The structure 100 of FIG. 4A may be altered to achieve an STT-MRAM cellthat is programmable with lower programming current. An example of howthe structure 100 may appear after it is altered to achieve an STT-MRAMcell in accordance with embodiments of the present technique is depictedin the altered structure 120 of FIG. 4B. The altered structure 120 mayinclude all the elements of the original structure 100, and may furtherinclude a nonmagnetic filament contact 112 which provides a connectionbetween the free layer 102 and the pinned layer 106 through theinsulative layer 104. One example of how the nonmagnetic filamentcontact 112 may be formed is to apply a high voltage to the structure100 of FIG. 4A. The electric field in the structure 100 may cause theinsulative layer 104 to break, such that a nanochannel may be formedwithin the insulative layer 104. Nonmagnetic material from thenonmagnetic source layer 106 may fill a nanochannel to create thenonmagnetic filament contact 112. While the insulative layer 104 in theoriginal structure 100 may substantially block a current travellingthrough the stack, the nonmagnetic filament contact 112 formed in thealtered structure 120 may provide a current path through the insulativelayer 104 to connect the free and pinned layers 102 and 108. Thiscurrent path may have a cross section that is significantly smaller thanthe cross section of the magnetic cell structure 100 or 120.

As previously discussed, the STT-MRAM cell may be programmed byswitching the magnetization of the free layer to be either parallel tothe magnetization of the pinned layer (low resistance state) orantiparallel to the magnetization of the pinned layer (high resistancestate). To switch the free layer magnetization, a programming currentmay be applied perpendicularly through the layers of an STT-MRAM cellstructure. Since the programming current flows axially through the freelayer, the programming current density in the free layer of a typicalSTT-MRAM cell would be the programming current per cross sectional area,or the electric current in amperes, divided by the cross section (i.e.,width*depth) of the free layer. However, as discussed below inaccordance with embodiments of the present invention, the programmingcurrent can be reduced without reducing the cross section and/or thevolume of the free layer 102.

In embodiments of the present techniques, a programming current may beapplied through the magnetic cell structure 120 and may flow from thepinned layer 108 to the nonmagnetic source layer 104 and through thenonmagnetic filament contact 112 to the free layer 102. The crosssection of the filament contact 112 may be significantly smaller thanthe cross section of the structure 120 or other layers in the structure120. The flow of the programming current is limited to the cross sectionof the filament contact 112 because the material surrounding thefilament contact 112 is insulative material 104. Since the crosssectional area of the programming current flow is limited immediatelyprior to flowing through the free layer 102, the cross sectional area ofthe programming current flow through the free layer 102 may also besubstantially determined by the cross section of the filament contact112. This may produce a programming current path with a reduced crosssectional area through the free layer 102. In some embodiments, theswitch of magnetization in a portion of the free layer 102 may alsopropagate through the rest of the free layer 102 after some period oftime.

A reduced cross sectional area of the current flow in the free layer 102has an inverse effect on the programming current density in the freelayer 102, as shown in the equation calculating current density:

I=J _(c) *A,

where I represents a current, J_(c) represents current density, and Arepresents the cross sectional area of the current. As seen in thisequation, A and J_(c) are inversely related. Thus, when the crosssectional area of a current is reduced, a proportionally reduced currentcan maintain the same current density.

In the present structure 120, and in embodiments of the presenttechniques, the cross sectional area of the programming current throughthe free layer 102 may be significantly smaller because the currentflows to the free layer 102 from the filament contact 112, which has amuch smaller cross section (i.e., the thickness of the filament contact112). Because of the inverse relationship between the cross sectionalarea of current and the current density, the smaller cross sectionalarea of current flow through the free layer 102 may enable a lowerprogramming current to have a current density that is still greater thanthe critical switching current density. When a current density throughthe free layer 102 is greater than a critical switching current density,the free layer magnetization may be switched. Thus, in some embodiments,a smaller programming current may switch the magnetization of the freelayer 102, or a portion of the free layer 102. In embodiments, themagnetization switch in the portion of the free layer 102 may propagatethrough the volume of the free layer, such that all or substantially allof the free layer 102 may switch in magnetization.

Read operations may also involve sending a read current, which may flowthrough the cell to determine the resistance between the free layer 102and the pinned layer 108. As the read current may also flow through thenonmagnetic filament contact 112, the path of the read current throughthe free layer 102 may also be limited to an area that is approximatelythe thickness of the filament contact 112. Therefore, the read currentmay measure the resistance of the structure 120 through the portion ofthe free layer 102 that has been switched by the programming current.

Although the FIG. 4B depicts a nonmagnetic filament contact 112extending perpendicularly from the nonmagnetic source layer 106, thefilament contact 112 may be formed to have any shape that electricallyconnects the free layer 102 and the pinned layer 108. For example, whenan electric field causes the insulative layer 104 to break, thenanochannel(s) formed in the insulative layer 104 may take randomshapes. Since the shape of the nanochannel(s) may differ, the crosssection of the filament contact 112 may not be uniform throughoutdifferent magnetic cell structures 120. It is also possible that morethan one nanochannel, and more than one filament contact 112 may beformed in the insulative layer 104, and partial nanochannels may alsooccur in the insulative layer 104, for a given memory cell.

Generating an electric field in the structure 100 is an example of how anonmagnetic filament contact 112 may be formed in a magnetic cellstructure. For example, a high voltage of approximately 3-5 volts maygenerate an electric field sufficient to form nanochannels in theinsulative layer 104. However, any other suitable method, for example,field driven solid electrolyte filament formation, may formnanochannels, or nonmagnetic filament contacts 112 in accordance withthe present techniques. Furthermore, the formation of the filamentcontact 112 may occur during or after the fabrication of the originalstructure 100. For example, the filament contact 112 may be formedduring the testing of the cell. The filament contact 112 may also beformed during the first write process of the cell.

The examples of materials discussed below may be used in embodiments inaccordance with the present technique. In some embodiments, the freelayer 102 and the pinned layer 108 may comprise ferromagnetic materials,such as Co, Fe, Ni or its alloys, NiFe, CoFe, CoNiFe, or doped alloysCoX, CoFeX, CoNiFeX (X=B, Cu, Re, Ru, Rh, Hf, Pd, Pt, C), or otherhalf-metallic ferromagnetic material such as Fe3O4, CrO2, NiMnSb andPtMnSb, and BiFeO, for instance. The nonmagnetic source layer 106 andthe nonmagnetic filament contact 112 may comprise materials such as Cu,Ag, any other suitable conductive nonmagnetic materials, or anycombination of the above materials, and may have a thickness ofapproximately 5-15 nm. The insulative layer 104 may comprise materialssuch as SiN, SiC, or any other suitable dielectric. The insulative layer104 may also comprise chalcogenide material, such as GeSe or GeS, or anycombination of the above materials, and may have a thickness ofapproximately 10 nm-30 nm.

While the invention may be susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, it should be understood that the invention is not intended tobe limited to the particular forms disclosed. Rather, the invention isto cover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the followingappended claims.

1. (canceled)
 2. A method of fabricating a magnetic cell structurecomprising: forming a first magnetic layer; forming a nonmagnetic layeron the first magnetic layer; forming an insulative layer on thenonmagnetic layer; forming a second magnetic layer on the insulativelayer; and after forming the second magnetic layer on the insulativelayer, forming at least one nanochannel through the insulative layer. 3.The method, as set forth in claim 2, wherein forming the first magneticlayer comprises forming a pinned layer.
 4. The method, as set forth inclaim 2, wherein forming the second magnetic layer comprises forming afree layer.
 5. The method, as set forth in claim 2, wherein forming theat least one nanochannel though the insuative layer comprises generatingan electric field to form a break through the insulative layer.
 6. Themethod, as set forth in claim 2, comprising filling the at least onenanochannel with a nonmagnetic filament contact.
 7. The method, as setforth in claim 6, wherein filling the at least one nanochannel with anonmagnetic filament contact comprises filling the at least onenanochannel with material from the nonmagnetic layer.
 8. The method, asset forth in claim 6, wherein filling the at least one nanochannelcomprises filling the at least one nanochannel with copper (Cu), silver(Ag), or a combination thereof.
 9. The method, as set forth in claim 2,wherein forming the nonmagnetic layer comprises forming a nonmagneticlayer having a thickness in a range of approximately 5-15 nanometers.10. The method, as set forth in claim 2, wherein forming the insulativelayer comprises forming an insulative layer having a thickness in arange of approximately 10-30 nanometers.
 11. A method of fabricating amagnetic cell structure comprising: forming a first magnetic layer;forming a nonmagnetic layer on the first magnetic layer; forming aninsulative layer on the nonmagnetic layer; forming a second magneticlayer on the insulative layer; and after forming the second magneticlayer on the insulative layer, forming an electrically conductive paththrough the insulative layer such that the first magnetic layer iselectrically coupled to the second magnetic layer.
 12. The method, asset forth in claim 11, wherein forming the electrically conductive paththrough the insulative layer comprises inducing an electric field in theunsulative layer.
 13. The method, as set forth in claim 12, whereininducing the electric filed forms breaks through the insulative layer.14. The method, as set forth in claim 13, wherein material from thenonmagnetic layer fills the breaks through the insulative layer.
 15. Themethod, as set forth in claim 11, wherein forming the electricallyconductive path comprises forming the electrically conductive path frommaterial in the nonmagnetic layer.
 16. A method of fabricating amagnetic cell structure comprising: forming a first magnetic layer;forming a nonmagnetic layer on the first magnetic layer, wherein thenonmagnetic layer comprises a thickness in a range of approximately 5-15nanometers; forming an insulative layer on the nonmagnetic layer,wherein the insulative layer comprises a thickness in a range ofapproximately 10-30 nanometers; forming a second magnetic layer on theinsulative layer; and forming a filament contact through the insulativelayer such that the first magnetic layer is electrically coupled to thesecond magnetic layer.
 17. The method, as set forth in claim 16, whereinforming the first magnetic layer comprises forming a pinned layer. 18.The method, as set forth in claim 16, wherein forming the secondmagnetic layer comprises forming a free layer.
 19. The method, as setforth in claim 16, wherein forming the nonmagnetic layer comprisesforming a layer comprising copper (Cu), silver (Ag) or a combinationthereof.
 20. The method, as set froth in claim 16, wherein forming theinsulating layer comprises forming silicon nitride, silicon carbide or acombination thereof.
 21. The method, as set forth in claim 16, whereinforming the filament contact comprises forming an electricallyconductive path through the insulating layer employing material from thenonmagnetic layer.